An X-Band Waveguide Jig for Pre-Screening Testing of Fully-Integrated Elementary Phased-Array Transceiver Antenna-in-Package

Li Han Chang, Chien Cheng Wang, Yue Ming Wu, Ta Shun Chu, Yu-Jiu Wang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A large 9-10 GHz tile-based scalable phased-array system (over 128 elements) is built by flip-chip bonding of elementary antenna-in-package (AiP) modules on a large interposer PCB. Each module has a top radiating surface and a bottom BGA bonding surface. Due to the strict spacing requirement of a phased-array system, rework of any failed modules from the interposer PCB is prone to create more damages to the system and is prohibited. It is necessary to have a reliable and Automatic Test Equipment (ATE)-compatible test procedures to pre-screen qualified elementary modules for bonding. However, conventional ATE-compatible test jig designs can neither receive radiation signals from antenna nor feed test signals into the antenna. In this paper, a waveguide jig for AiP pre-screening is proposed. This jig system consists of a WR-90 adapter, a horn antenna, a Torlon cap and socket with POGO pins, and a PCB to interface with ATE. To test AiP transmitter, controls and test signals are provided through PCB connectors, with radiation signals collected from the WR-90 adaptor. To test the AiP receiver, radiation signals are feeding through the WR-90 adaptor, and the receiver output signals are collected from the PCB connectors. To calibrate waveguide jig return loss, a set of AiP SOL modules are used to remove PCB and test fixture loss from the overall system loss. The waveguide jig achieves a flat simulated -2.4 dB from AiP antenna port to waveguide port from 8 to 12 GHz. This waveguide jig provides a fast and reliable approach to select qualified AiP for phased array system assemblies, and the final system-level over-the-air testing.

Original languageEnglish
Title of host publication2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1248-1253
Number of pages6
ISBN (Electronic)9784885523151
DOIs
StatePublished - 31 Dec 2018
Event2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Toyama, Japan
Duration: 1 Aug 20184 Aug 2018

Publication series

NameProgress in Electromagnetics Research Symposium
Volume2018-August
ISSN (Print)1559-9450
ISSN (Electronic)1931-7360

Conference

Conference2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018
CountryJapan
CityToyama
Period1/08/184/08/18

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