An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Yu Chieh Huang, Po-Tsang Huang, Shang Lin Wu, Yu Chen Hu, Yan Huei You, Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

Original languageEnglish
Title of host publicationISCAS 2016 - IEEE International Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1302-1305
Number of pages4
ISBN (Electronic)9781479953400
DOIs
StatePublished - 29 Jul 2016
Event2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada
Duration: 22 May 201625 May 2016

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2016-July
ISSN (Print)0271-4310

Conference

Conference2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
CountryCanada
CityMontreal
Period22/05/1625/05/16

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