An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration

Tsung Yen Tsai, Chien Hung Lin, Chia Lin Lee, Shan Chun Yang, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

An ultra-fast temporary bonding and release process was investigated for the improvement of 3D integration. The bonding scheme composes of two different kinds of polymer for release layer and adhesive layer. The submicron release layer is a positive photoresist with the characteristic of high UV absorption induced into the de-bonding procedure within 20 s. In addition, the adhesive layer provides robust mechanical strength for the wafer thinning process. Based on results, this structure is a potential candidate for temporary bonding and de-bonding technique in 3D integration.

Original languageEnglish
Title of host publication2015 International 3D Systems Integration Conference, 3DIC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesTS8.8.1-TS8.8.5
ISBN (Electronic)9781467393850
DOIs
StatePublished - 20 Nov 2015
EventInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan
Duration: 31 Aug 20152 Sep 2015

Publication series

Name2015 International 3D Systems Integration Conference, 3DIC 2015

Conference

ConferenceInternational 3D Systems Integration Conference, 3DIC 2015
CountryJapan
CitySendai
Period31/08/152/09/15

Keywords

  • 3D integration
  • laser release process
  • photolysis polymer
  • Temporary bonding technology

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