An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

Yu Min Lin, Sheng Tsai Wu, Wen Wei Shen, Shin Yi Huang, Tzu Ying Kuo, Ang Ying Lin, Tao Chih Chang, Hsiang Hung Chang, Shu Man Lee, Chia Hsin Lee, Jay Su, Xiao Liu, Qi Wu, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

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Chemical Compounds

Engineering & Materials Science