An RDL-first fan-out panel-level package for heterogeneous integration applications

Yu Min Lin, Sheng Tsai Wu, Chun Min Wang, Chia Hsin Lee, Shin Yi Huang, Ang Ying Lin, Tao Chih Chang, Puru Bruce Lin, Cheng Ta Ko, Yu Hua Chen, Jay Su, Xiao Liu, Luke Prenger, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Technologies of Fan-out panel-level packaging (FOPLP) are studies in this paper. First, the warpage control of a molded panel is a crucial problem for FOWLP technology development. In this paper, finite element analysis (FEA) is applied to study the influence of back end of the line (BEOL) process-induced warpage, as well as characterization for simulation, and investigation of each single process. In our process, a liquid release material is coated onto a 370 mm x 470 mm glass carrier. After baking, three layers of redistribution layer (RDL), passivation, and Cu leads are fabricated on the panel with coating, exposing, developing, lithography, and electroplating processes. Silicon test chips with a size of 10 mm x 10 mm and micro solder bumps with a pitch of 90mm are thinned down to 150 mm. Test chips are then flip-chip bonded onto glass carrier with pre-bond and reflow proces. After panel molding, a laser debonding method, another key technology advancement, is utilized for panel debond. Debond performance, which is directly related to laser parameter and panel-level package (PLP) structure, is critical. After debonding, the molded panel is cleaned, followed by dicing and OSP coating processes, and then the electrical performance of the interconnection is evaluated. Reliability tests at the component level, such as pre-condition, thermal cycling test (TCT), and unbiased HAST (uHAST), are performed. The demonstration of RDL-first PLP technology without interposers proves its great potential in heterogeneous integration applications.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1463-1469
Number of pages7
ISBN (Electronic)9781728114989
DOIs
StatePublished - 1 May 2019
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2019-May
ISSN (Print)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period28/05/1931/05/19

Keywords

  • Fan-out panel-level packaging
  • Finite element analysis (FEA)
  • FO-WLP
  • Process development
  • Warpage

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    Lin, Y. M., Wu, S. T., Wang, C. M., Lee, C. H., Huang, S. Y., Lin, A. Y., Chang, T. C., Lin, P. B., Ko, C. T., Chen, Y. H., Su, J., Liu, X., Prenger, L., & Chen, K-N. (2019). An RDL-first fan-out panel-level package for heterogeneous integration applications. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 1463-1469). [8811283] (Proceedings - Electronic Components and Technology Conference; Vol. 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2019.00225