TY - GEN
T1 - An image combiner and acquisition interface for space remote sensing applications
AU - Chen, Tsan Jieh
AU - Chiueh, Her-Ming
AU - Tsai, Hann Huei
AU - Chiu, Chin Fong
PY - 2009/12/1
Y1 - 2009/12/1
N2 - high resolution image combination and processing plays an important role in today's satellites' remote sensing applications. This paper presents an image recombination and processing circuitries (ICAI) for one-dimensional multi-strip CMOS image sensors. The proposed system take advantage of the satellites' linear moving property to control the expose time of CMOS image sensor and provides the realtime ability to continuous generate 12, 000 × N high-resolution image for space remote sensing applications. The ICAI chip contains an image sensor control logics, image combiner, and host interface, one-dimensional pixel is combined to form a two-dimensional image by proposed circuitry. A prototype chip of ICAI was designed and fabricated with TSMC 0.18 μm CMOS 1P6M technology. The die size is 2.91 mm by 2.91 mm, and the power consumption is 20 mW operating at 8MHz under a 1.8 V supply voltage.
AB - high resolution image combination and processing plays an important role in today's satellites' remote sensing applications. This paper presents an image recombination and processing circuitries (ICAI) for one-dimensional multi-strip CMOS image sensors. The proposed system take advantage of the satellites' linear moving property to control the expose time of CMOS image sensor and provides the realtime ability to continuous generate 12, 000 × N high-resolution image for space remote sensing applications. The ICAI chip contains an image sensor control logics, image combiner, and host interface, one-dimensional pixel is combined to form a two-dimensional image by proposed circuitry. A prototype chip of ICAI was designed and fabricated with TSMC 0.18 μm CMOS 1P6M technology. The die size is 2.91 mm by 2.91 mm, and the power consumption is 20 mW operating at 8MHz under a 1.8 V supply voltage.
UR - http://www.scopus.com/inward/record.url?scp=77950653995&partnerID=8YFLogxK
U2 - 10.1109/MWSCAS.2009.5236053
DO - 10.1109/MWSCAS.2009.5236053
M3 - Conference contribution
AN - SCOPUS:77950653995
SN - 9781424444793
T3 - Midwest Symposium on Circuits and Systems
SP - 475
EP - 478
BT - 2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
Y2 - 2 August 2009 through 5 August 2009
ER -