An image combiner and acquisition interface for space remote sensing applications

Tsan Jieh Chen*, Her-Ming Chiueh, Hann Huei Tsai, Chin Fong Chiu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

high resolution image combination and processing plays an important role in today's satellites' remote sensing applications. This paper presents an image recombination and processing circuitries (ICAI) for one-dimensional multi-strip CMOS image sensors. The proposed system take advantage of the satellites' linear moving property to control the expose time of CMOS image sensor and provides the realtime ability to continuous generate 12, 000 × N high-resolution image for space remote sensing applications. The ICAI chip contains an image sensor control logics, image combiner, and host interface, one-dimensional pixel is combined to form a two-dimensional image by proposed circuitry. A prototype chip of ICAI was designed and fabricated with TSMC 0.18 μm CMOS 1P6M technology. The die size is 2.91 mm by 2.91 mm, and the power consumption is 20 mW operating at 8MHz under a 1.8 V supply voltage.

Original languageEnglish
Title of host publication2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
Pages475-478
Number of pages4
DOIs
StatePublished - 1 Dec 2009
Event2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09 - Cancun, Mexico
Duration: 2 Aug 20095 Aug 2009

Publication series

NameMidwest Symposium on Circuits and Systems
ISSN (Print)1548-3746

Conference

Conference2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
CountryMexico
CityCancun
Period2/08/095/08/09

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