An image combiner and acquisition interface for space remote sensing applications

Tsan Jieh Chen; Her-Ming Chiueh; Hann Huei Tsai; Chin Fong Chiu

doi:10.1109/MWSCAS.2009.5236053

An image combiner and acquisition interface for space remote sensing applications

Tsan Jieh Chen^*, Her-Ming Chiueh, Hann Huei Tsai, Chin Fong Chiu

^*Corresponding author for this work

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

high resolution image combination and processing plays an important role in today's satellites' remote sensing applications. This paper presents an image recombination and processing circuitries (ICAI) for one-dimensional multi-strip CMOS image sensors. The proposed system take advantage of the satellites' linear moving property to control the expose time of CMOS image sensor and provides the realtime ability to continuous generate 12, 000 × N high-resolution image for space remote sensing applications. The ICAI chip contains an image sensor control logics, image combiner, and host interface, one-dimensional pixel is combined to form a two-dimensional image by proposed circuitry. A prototype chip of ICAI was designed and fabricated with TSMC 0.18 μm CMOS 1P6M technology. The die size is 2.91 mm by 2.91 mm, and the power consumption is 20 mW operating at 8MHz under a 1.8 V supply voltage.

Original language	English
Title of host publication	2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
Pages	475-478
Number of pages	4
DOIs	https://doi.org/10.1109/MWSCAS.2009.5236053
State	Published - 1 Dec 2009
Event	2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09 - Cancun, Mexico Duration: 2 Aug 2009 → 5 Aug 2009

Publication series

Name	Midwest Symposium on Circuits and Systems
ISSN (Print)	1548-3746

Conference

Conference	2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09
Country	Mexico
City	Cancun
Period	2/08/09 → 5/08/09

Access to Document

10.1109/MWSCAS.2009.5236053

Link to publication in Scopus

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Cite this

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title = "An image combiner and acquisition interface for space remote sensing applications",

abstract = "high resolution image combination and processing plays an important role in today's satellites' remote sensing applications. This paper presents an image recombination and processing circuitries (ICAI) for one-dimensional multi-strip CMOS image sensors. The proposed system take advantage of the satellites' linear moving property to control the expose time of CMOS image sensor and provides the realtime ability to continuous generate 12, 000 × N high-resolution image for space remote sensing applications. The ICAI chip contains an image sensor control logics, image combiner, and host interface, one-dimensional pixel is combined to form a two-dimensional image by proposed circuitry. A prototype chip of ICAI was designed and fabricated with TSMC 0.18 μm CMOS 1P6M technology. The die size is 2.91 mm by 2.91 mm, and the power consumption is 20 mW operating at 8MHz under a 1.8 V supply voltage.",

author = "Chen, {Tsan Jieh} and Her-Ming Chiueh and Tsai, {Hann Huei} and Chiu, {Chin Fong}",

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Chen, TJ, Chiueh, H-M, Tsai, HH & Chiu, CF 2009, An image combiner and acquisition interface for space remote sensing applications. in 2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09., 5236053, Midwest Symposium on Circuits and Systems, pp. 475-478, 2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09, Cancun, Mexico, 2/08/09. https://doi.org/10.1109/MWSCAS.2009.5236053

An image combiner and acquisition interface for space remote sensing applications. / Chen, Tsan Jieh; Chiueh, Her-Ming; Tsai, Hann Huei; Chiu, Chin Fong.

2009 52nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS '09. 2009. p. 475-478 5236053 (Midwest Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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