An efficient thermal estimation scheme for microprocessors

Pei Shu Huang*, Quan Chung Chen, Chen Wei Huang, Shiao-Li Tsao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In recent years, thermal management, which improves the reliability, performance, power leakage, etc. of modern microprocessors, has been the subject of numerous computer architecture and system software studies. To determine the detailed thermal distribution of a microprocessor is among the critical tasks for thermal management. However, because thermal modeling tools require considerable computation time and memory to simulate fine-grain thermal information, they may be unsuitable for dynamic thermal management and hardware implementation. This study proposes a novel model based on reduced resistance-capacitance (RC) networks for efficiently calculating the temperature of a microprocessor. The proposed model is compared with two existing thermal simulation tools, namely, HotSpot [1] and Temptor [2]. The experiment studies show that the results generated using the proposed model differ from those of the existing tools by only 0.5 to 1.5%. However, the suggested model can increase computation speeds by 5 to 9 times and 98 to 161 times that of Temptor and HotSpot, respectively. For the memory usage, the proposed model consumes merely 0.45% of the space used by the existing tools.

Original languageEnglish
Title of host publicationRTCSA 2014 - 20th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479939534
DOIs
StatePublished - 25 Sep 2014
Event20th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications, RTCSA 2014 - Chongqing, China
Duration: 20 Aug 201422 Aug 2014

Publication series

NameRTCSA 2014 - 20th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications

Conference

Conference20th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications, RTCSA 2014
CountryChina
CityChongqing
Period20/08/1422/08/14

Keywords

  • dynamic thermal management (DTM)
  • leakage power
  • thermal estimation
  • thermal model

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