An efficient metal-core printed circuit board with a copper-filled through (blind) hole for light-emitting diodes

Je Yi Wu*, Chih Ming Chen, Ray-Hua Horng, Dong Sing Wuu

*Corresponding author for this work

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently removes the heat generated by the light-emitting diode (LED) chip. Compared with a conventional MCPCB, the MCPCB with a Cu-filled through (blind) hole significantly reduces the peak surface temperature of the LED chip from 46 ° C to 39 ° C and the total thermal resistance from 8.9 to 2.8 K/W.

Original languageEnglish
Article number6374640
Pages (from-to)105-107
Number of pages3
JournalIEEE Electron Device Letters
Volume34
Issue number1
DOIs
StatePublished - 1 Jan 2013

Keywords

  • Light-emitting diodes (LEDs)
  • packaging
  • thermal resistance

Fingerprint Dive into the research topics of 'An efficient metal-core printed circuit board with a copper-filled through (blind) hole for light-emitting diodes'. Together they form a unique fingerprint.

Cite this