An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system

Yu Chen Hu, Chun Pin Lin, Hsiao Chun Chang, Yu Tao Yang, Chi Shi Chen, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

To cater complex topography sensors and circuit chips for smart lifestyle applications using Internet of Things (IoT), we develop a novel efficient double-self-assembly packaging approach by 3D/2.5D heterogeneous integration. This technology is able to integrate various kinds of processed chips, especially with uneven surface and bottom topography. With liquid surface tension, complex topography chips can be handled and self-aligned on precise locations. Double-self-assembly approach demonstrates temporary bonding on carrier wafer and self-aligned permanent bonding in a pressure sensing system packaging. The optimized volume of liquid to use on various complex topography shapes and areas are investigated, while Cu/In low temperature metal bonding and self-assembly approach for high I/O density and low bonding resistance are demonstrated. Excellent electrical characteristics and mechanical strength of show the feasibility of the double-self-assembly approach on complex topography surface chips packaging applications.

Original languageEnglish
Title of host publication2016 IEEE International Electron Devices Meeting, IEDM 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages9.2.1-9.2.4
ISBN (Electronic)9781509039012
DOIs
StatePublished - 31 Jan 2017
Event62nd IEEE International Electron Devices Meeting, IEDM 2016 - San Francisco, United States
Duration: 3 Dec 20167 Dec 2016

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference62nd IEEE International Electron Devices Meeting, IEDM 2016
CountryUnited States
CitySan Francisco
Period3/12/167/12/16

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