Abstract
An AlGaInP light-emitting diode (LED) with a Au/AuBe/SiO2/Si mirror substrate has been fabricated using wafer bonding. The bonded mirror-substrate LED is capable of emitting luminous intensity of 90 and 205 mcd under 20 and 50 mA injection, respectively. The emission wavelength was found to be independent of the injection current. This feature is attributed to the Si substrate providing a good heat sink.
Original language | English |
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Pages (from-to) | 3054-3056 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 75 |
Issue number | 20 |
DOIs | |
State | Published - 15 Nov 1999 |