Advanced RF/baseband interconnect schemes for inter- and intra-ULSI communications

Mau-Chung Chang*, Ingrid Verbauwhede, Charles Chien, Zhiwei Xu, Jongsun Kim, Jenwei Ko, Qun Gu, Bo-Cheng Lai

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

62 Scopus citations

Abstract

Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 100 Gbps/pin or 20-Tbps aggregate) as well as bidirectional multiI/O concurrent service, re-configurable computing/ processing architecture, and total compatibility with mainstream silicon system-on-chip and system-in-package technologies. In this paper, we review recent advances in interconnect schemes that promise to meet all of the above system requirements. Unlike traditional wired interconnects based solely on time-division multiple access for data transmission, these new interconnect schemes facilitate the use of additional multiple access techniques including code-division multiple access and frequency-division multiple access to greatly increase bandwidth and channel concurrency as well as to reduce channel latency. The physical transmission line is no longer limited to a direct-coupled metal wire. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and dc power consumption while simplifying the fabrication process by eliminating vertical metal studs needed in three-dimensional ICs. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next-generation computing/ processing systems.

Original languageEnglish
Pages (from-to)1271-1285
Number of pages15
JournalIEEE Transactions on Electron Devices
Volume52
Issue number7
DOIs
StatePublished - 1 Jul 2005

Keywords

  • 3-D IC interconnect
  • CDMA DRAM
  • CDMA-interconnect (CDMA-I)
  • FDMA DRAM
  • FDMA-interconnect (FDMA-I)
  • Inter/intra-ULSI communications
  • Multicarrier DCMA-Interconnect (MCCDMA-I)
  • Multilevel signal clock data recovery
  • RF-interconnect (RF-I)
  • Re-configurable interconnect for next-generation systems (RINGS)
  • Realtime re-configurable interconnects
  • Simultaneous and bidirectional multiI/O service

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