Infrared field programmable array (IR-FPA) structures and requirements, CMOS readout techniques, and future development trends in IR imaging systems are reviewed and discussed. The IR-FPA has the inherent advantages of high packing density, low cost, reduced signal leads through the dewar, high feasibility on-chip signal processing, and high flexibility for system integration. Due to the development of commercial-uncooled IR imaging systems and the fast advancement of submicron CMOS technologies, high performance and low cost IR imaging system will be made possible through the inventions of new circuit techniques and structure.
|Number of pages||16|
|Journal||Proceedings - IEEE International Symposium on Circuits and Systems|
|State||Published - 1 Jan 1997|
|Event||Proceedings of the 1997 IEEE International Symposium on Circuits and Systems, ISCAS'97 - Hong Kong, Hong Kong|
Duration: 9 Jun 1997 → 12 Jun 1997