Adhesive selection and bonding parameter optimization for hybrid bonding in 3D integration

Kuan-Neng Chen*, Cheng Ta Ko, Zhi Cheng Hsiao, Huan Chun Fu, Wei Chung Lo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Hybrid bonding, an emerging bonding approach with high yield and reliability, can achieve vertical interconnection with adhesive serving reinforcement of the mechanical stability between stacked ICs. To develop metal/adhesive hybrid bonding technology, four kinds of polymer materials, BCB, SU-8, AL-Polymer, and PI, were evaluated as the bonding adhesive. The compatibility between each polymer and metal was investigated, and the application range of each material was established thereof. Furthermore, the scheme of Cu-Sn-Cu interconnection hybridized with patterned BCB was designed and evaluated. Two key factors were discussed and optimized to perform the bonding integrity. The evaluation results and successful metal/adhesive hybrid bonding demonstration are disclosed in the paper.

Original languageEnglish
Pages (from-to)1821-1828
Number of pages8
JournalJournal of Nanoscience and Nanotechnology
Volume12
Issue number3
DOIs
StatePublished - 3 Jul 2012

Keywords

  • 3D IC
  • 3D integration
  • Bonding technology
  • Hybrid bonding

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