Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-Level Hybrid Bonding in 3D Integration

Cheng Hsien Lu, Yi Tung Kho, Yu Tao Yang, Yu Pei Chen, Chiao Pei Chen, Tsung Tai Hung, Chiu Feng Chen, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the four-point bending method experiments were carried out with different polyimides and passivation layers for realization of adhesion property below 400°C. Three types of passivation layers, thermal oxide, tetraethoxysilane (TEOS) oxide, silicon nitride, and three types of polyimides, with hydrophobic silane, with hydrophilic silane and without silane, and annealing temperature were all considered in this paper. Moreover, the relation between adhesion strength and surface roughness is discussed. Finally, a low thermal budget (250-375°C) polyimide/metal hybrid bonding scheme with good stress release was proposed for future hybrid bonding applications.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages401-406
Number of pages6
ISBN (Print)9781538649985
DOIs
StatePublished - 7 Aug 2018
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: 29 May 20181 Jun 2018

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2018-May
ISSN (Print)0569-5503

Conference

Conference68th IEEE Electronic Components and Technology Conference, ECTC 2018
CountryUnited States
CitySan Diego
Period29/05/181/06/18

Keywords

  • 3D integration
  • Adhesion
  • Four point bending
  • Hybrid bonding
  • Polyimide
  • Polyimide-like

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