Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

Cheng Hsien Lu, Yi Lun Yang, Chiao Pei Chen, Bin Ling Tsai, Kuan Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This article investigates the adhesion properties between the polyimide layers and the Ti/Cu layer after the electroplating process. The adhesion strength was evaluated by the four-point bending system, and the influence factors were confirmed by using different electroplating times and currents. The fracture interface after the four-point bending measurement was characterized, and the interface spectrum between the polyimide and the Ti/Cu layer was analyzed. The results showed that the modified polyimide-like material has better adhesion performance than the conventional polyimide. Moreover, the mechanism of degradation was proposed. As a result, the modified polyimide-like material can be applied in electroplating, a redistribution layer (RDL) formation, and packaging at the back-end-of-line processes.

Original languageEnglish
Article number8843892
Pages (from-to)168-175
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume10
Issue number1
DOIs
StatePublished - Jan 2020

Keywords

  • Adhesion
  • electroplating
  • polyimide
  • X-ray photoelectron spectroscopy (XPS)

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