Adhesion investigation between metal and benzocyclobutene (BCB) polymer dielectric materials in 3-D integration applications

Jian Yu Shih, Wen Chun Huang, Cheng Ta Ko, Zheng Yang, Sheng Hsiang Hu, Leu-Jih Perng, Keng C. Chou, Kuan-Neng Chen

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

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Chemical Compounds

Engineering & Materials Science