TY - JOUR
T1 - Adhesion investigation between metal and benzocyclobutene (BCB) polymer dielectric materials in 3-D integration applications
AU - Shih, Jian Yu
AU - Huang, Wen Chun
AU - Ko, Cheng Ta
AU - Yang, Zheng
AU - Hu, Sheng Hsiang
AU - Perng, Leu-Jih
AU - Chou, Keng C.
AU - Chen, Kuan-Neng
PY - 2014/9/1
Y1 - 2014/9/1
N2 - In this paper, the interfacial adhesion strength between metal layer and benzocyclobutene (BCB) polymer dielectric in 3-D integration applications is investigated. The effects of layer thickness, layer stacking order, and additional adhesion layer of titanium (Ti) layer between copper (Cu) and BCB polymer are investigated. Surprisingly, the conventional titanium adhesion layer commonly used in the semiconductor industry weakens the interfacial adhesion strength between copper and BCB. Additionally, to figure out the interfacial adhesion mechanisms, the interfacial structures probed by sum-frequency-generation vibrational spectroscopy are correlated to the adhesion strengths measured from corresponding sample interfaces. It is found that ordered C-H groups at the metal/BCB interface, such as titanium/BCB or molybdenum/BCB, lead to weak interfacial adhesion strength, whereas disordered interfaces, i.e., copper/BCB, lead to strong interfacial adhesion strength.
AB - In this paper, the interfacial adhesion strength between metal layer and benzocyclobutene (BCB) polymer dielectric in 3-D integration applications is investigated. The effects of layer thickness, layer stacking order, and additional adhesion layer of titanium (Ti) layer between copper (Cu) and BCB polymer are investigated. Surprisingly, the conventional titanium adhesion layer commonly used in the semiconductor industry weakens the interfacial adhesion strength between copper and BCB. Additionally, to figure out the interfacial adhesion mechanisms, the interfacial structures probed by sum-frequency-generation vibrational spectroscopy are correlated to the adhesion strengths measured from corresponding sample interfaces. It is found that ordered C-H groups at the metal/BCB interface, such as titanium/BCB or molybdenum/BCB, lead to weak interfacial adhesion strength, whereas disordered interfaces, i.e., copper/BCB, lead to strong interfacial adhesion strength.
KW - 3-D integration
KW - Adhesion
KW - benzocyclobutene (BCB)
UR - http://www.scopus.com/inward/record.url?scp=84930944245&partnerID=8YFLogxK
U2 - 10.1109/TDMR.2014.2343793
DO - 10.1109/TDMR.2014.2343793
M3 - Article
AN - SCOPUS:84930944245
VL - 14
SP - 914
EP - 920
JO - IEEE Transactions on Device and Materials Reliability
JF - IEEE Transactions on Device and Materials Reliability
SN - 1530-4388
IS - 3
M1 - 6866908
ER -