Adhesion and fracture of metal/polyimide fine line structures

Paul S. Ho*, Tze Wing Poon, Leu-Jih Perng

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

The fracture behavior of Au/Cr line structures formed on semiflexible and rigid-rod like polyimide film substrates has been investigated using a stretch deformation technique. The effects of metal line dimensions on the deformation behavior can be attributed to the change in the mechanical environment induced by confinement at the metal/polymer interface. Finite element analysis was employed to analyze the fracture behavior observed and found that plastic yields of the metal line and the polymer film are important in controlling the deformation behavior and energy dissipation of the delamination process. Due to the plastic yield of the metal, the interfacial stress behavior is found to be relatively insensitive as a function of the line dimension, and the edge stress concentration can not account for the delamination observed. Instead, the deformation energy is important in controlling the delamination of the metal-polymer line structure. Since the deformation energy stored in the polyimide is an order-of-magnitude higher than that in the metal, it dominates the energetics of the fracture process. The energy profile along the interface shows that maximum deformation occurs in the vicinity of the metal line edge where fracture is initiated.

Original languageEnglish
Pages63-70
Number of pages8
StatePublished - 1 Dec 1995
EventProceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA
Duration: 12 Nov 199517 Nov 1995

Conference

ConferenceProceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition
CitySan Francisco, CA, USA
Period12/11/9517/11/95

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