Accessing manufacturing yield for gamma wafer sawing processes in COG packaging

W.l. Pearn*, Yu Ting Tai, Kai Bin Huang, Pin Lun Ku

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Fingerprint Dive into the research topics of 'Accessing manufacturing yield for gamma wafer sawing processes in COG packaging'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science