Bonded copper interconnects were stressed with current to measure the specific contact resistance. For bonded copper interconnects without a prebonding HCl clean, the corresponding specific contact resistance did not change while increasing the stress current. However, for some interconnects with the prebonding HCl clean, an abnormal contact resistance reduction was observed during the increase of the stress current. The rise of temperature at the bonding interface area due to Joule heating under high current density may have caused the decrease of contact resistance. This behavior may be one option for quality enhancement in 3D integration at low temperature.