Ablation lithography for TFT-LCD

Kenkichi Suzuki*, Nobuaki Hayashi, Hiroshi Masuhara, Thomas K. Lippert

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Ablation lithography is based on the photo-decomposition ablation of polymer materials by excimer laser. It is a self-development process, and accordingly possible to reduce the throughput time and manufacturing cost of TFT-LCD. The major alterations from the conventional photolithography are the resist material and the mask. Developing both the technologies and using an experimental exposure& aligner, we fabricated a TFT pattern on 300 × 400 mm2 glass substrate. The result proves the feasibility of EAL as an high throughput lithography suitable for a-Si TFT.

Original languageEnglish
Title of host publicationAdvanced Materials and Devices for Large-Area Electronics
Pages1-10
Number of pages10
DOIs
StatePublished - 1 Dec 2001
Event2001 MRS Spring Meeting - San Francisco, CA, United States
Duration: 16 Apr 200120 Apr 2001

Publication series

NameMaterials Research Society Symposium Proceedings
Volume685
ISSN (Print)0272-9172

Conference

Conference2001 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period16/04/0120/04/01

Fingerprint Dive into the research topics of 'Ablation lithography for TFT-LCD'. Together they form a unique fingerprint.

  • Cite this

    Suzuki, K., Hayashi, N., Masuhara, H., & Lippert, T. K. (2001). Ablation lithography for TFT-LCD. In Advanced Materials and Devices for Large-Area Electronics (pp. 1-10). (Materials Research Society Symposium Proceedings; Vol. 685). https://doi.org/10.1557/PROC-685-D1.2.1