Ablation lithography for TFT-LCD

Kenkichi Suzuki*, Nobuaki Hayashi, Hiroshi Masuhara, Thomas K. Lippert

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations


Ablation lithography is based on the photo-decomposition ablation of polymer materials by excimer laser. It is a self-development process, and accordingly possible to reduce the throughput time and manufacturing cost of TFT-LCD. The major alterations from the conventional photolithography are the resist material and the mask. Developing both the technologies and using an experimental exposure& aligner, we fabricated a TFT pattern on 300 × 400 mm2 glass substrate. The result proves the feasibility of EAL as an high throughput lithography suitable for a-Si TFT.

Original languageEnglish
Title of host publicationAdvanced Materials and Devices for Large-Area Electronics
Number of pages10
StatePublished - 1 Dec 2001
Event2001 MRS Spring Meeting - San Francisco, CA, United States
Duration: 16 Apr 200120 Apr 2001

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Conference2001 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA

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