A System-Level Thermal Simulator with Automatic Meshing Techniques

Jui Hung Wang, Yu-Min Lee, Hsuan Hsuan Hsiao, Liang Chia Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The grid structure of most numerical thermal simulators has to be designed artificially. Designers might need to try many different grid structures for getting accurate thermal profiles, and, hence, waste a great of runtime. In order to solve this problem, this work presents a system-level thermal simulator, DeNAFE, which can adaptively mesh thermal grids automatically. First, we develop and employ a fast thermal estimation engine to roughly obtain the thermal profile of the system. Then, with this thermal profile, we propose and utilize an adaptive meshing procedure to decide its grid structure and perform thermal simulation. Compared with a commercial tool, ANSYS Icepak, the experimental results show that the speedup of DeNAFE can be up to two orders of magnitude with only 6.09% maximum error for all chips in the steady-state thermal simulation. Furthermore, the error of chips is less than 5.25%, the error of screen/skin is less than 6.03%, and the speedup can be over 171.12 times in the transient simulation.

Original languageEnglish
Title of host publicationProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages984-991
Number of pages8
ISBN (Electronic)9781538612729
DOIs
StatePublished - 24 Jul 2018
Event17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States
Duration: 29 May 20181 Jun 2018

Publication series

NameProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018

Conference

Conference17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
CountryUnited States
CitySan Diego
Period29/05/181/06/18

Keywords

  • adaptive meshing
  • circuit simulation
  • fast thermal estimator
  • finite difference method (FDM)
  • heat transfer equation
  • thermal gradient

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    Wang, J. H., Lee, Y-M., Hsiao, H. H., & Cheng, L. C. (2018). A System-Level Thermal Simulator with Automatic Meshing Techniques. In Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 (pp. 984-991). [8419468] (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2018.8419468