A study of the fabrication of flip-chip bumps using dry-film photoresist process on 300mm wafer

Zhi Ting Ke*, Cheng Shih Lee, Keng Huei Shen, Edward Yi Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This work is to study the dry-film photoresist to form patterns for Flip-Chip bumps on 300 mm wafers. The so-called "double-deck metal seed layer" process was also applied in this study by using sputtered 1000 Å Ti (Titanium) and 5000 Å Cu (Copper) metal layers. By welding the metal and solder electroplating technology on the chip of the integrated circuits , Cu / Ni / Solder alloy fill up hole under bumps metallization after solder re-flowing at 220°C. This research optimizes the parameters of the dry-film photoresist, lithography technology, metal sputtering technology and metal electroplating technology.

Original languageEnglish
Title of host publication2004 Semiconductor Manufacturing Technology Workshop Proceedings, SMTW
Pages75-78
Number of pages4
DOIs
StatePublished - 1 Dec 2004
Event2004 Semiconductor Manufacturing Technology Workshop Proceedings, SMTW - , Taiwan
Duration: 9 Sep 200410 Sep 2004

Publication series

Name2004 Semiconductor Manufacturing Technology Workshop Proceedings, SMTW

Conference

Conference2004 Semiconductor Manufacturing Technology Workshop Proceedings, SMTW
CountryTaiwan
Period9/09/0410/09/04

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