A study of impact reliability of lead-Free BGA bails on Au/Electrolytic Ni/Cu bond pad

Shengquan Ou*, Yuhuan Xu, King-Ning Tu, M. O. Alam, Y. C. Chan

*Corresponding author for this work

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground. The impact may cause interfacial fracture of wire-bonds or solder joints between a Si chip and its packaging module. Existing metrologies, such as ball shear, and pull test cannot well represent the shock reliability of the package. In this study, a micro-impact machine is utilized to test the impact reliability of three kinds of lead-free solders: 99Sn1Ag, 98.5Sn1Ag0.5Cu and 97.5Sn1Ag0.5Cul In (hereafter called Sn1Ag, Sn1Ag0.5Cu, and Sn1Ag0.5Cu1In). The effect of thermal aging on the impact toughness is also evaluated in this study. We find a ductile-to-brittle transition in SnAg (Cu) solder joints after thermal aging. The impact toughness is enhanced by the thermal aging. This is a combination effect of the growth of intermetallic compound (IMC) at the interface provided strong bonding, and the softening of the solder bulk during the thermal aging absorbed more energy during plastic deformation.

Original languageEnglish
Article numberB10.5
Pages (from-to)381-386
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume863
DOIs
StatePublished - 1 Jan 2005
Event2005 Materials Research Society Spring Meeting - San Francisco, CA, United States
Duration: 28 Mar 20051 Apr 2005

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