A study of high sensitive diaphragm for silicon microphone applications

Ray-Hua Horng*, Zong Ying Lin, Yu Ning Jiang, Shang Hua You, Shu Zhen Zhun, Ru Guan Wang, Shao Chih Chang, Tsun I. Tsai, Chung Chi Lai, Chi Liang Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the design and analysis of high sensitive diaphragm for electret microphone applications. In general, the sensitivity of electret microphone depends on the electrical sensitivity and the mechanical sensitivity of the diaphragm. The high mechanical sensitivity can be determined by the mechanical properties of the diaphragm. In order to obtain high sensitive microphones, the properties of low tensile stress and larger area of the diaphragms were fabricated. In this study, the spacer and the thickness of the backplate of electret microphone are 16 μm and 120 μm, respectively. The diaphragm made of polyimide and Si3N4 materials with various thickness and area were evaluated. It was found that the diaphragm made of polyimide presents the better sensitivity as compared with that made of Si3N4 materials. On the other hand, the larger area of diaphragm results in the higher sensitivity of the microphone. The corresponding sensitivity is 9 mV/Pa in the frequency range of 50 Hz to 12 kHz under the electret material with -120 V.

Original languageEnglish
Title of host publication2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers
Pages73-76
Number of pages4
DOIs
StatePublished - 1 Dec 2006
Event2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT - Taipei, Taiwan
Duration: 18 Oct 200620 Oct 2006

Publication series

Name2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers

Conference

Conference2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT
CountryTaiwan
CityTaipei
Period18/10/0620/10/06

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  • Cite this

    Horng, R-H., Lin, Z. Y., Jiang, Y. N., You, S. H., Zhun, S. Z., Wang, R. G., Chang, S. C., Tsai, T. I., Lai, C. C., & Chen, C. L. (2006). A study of high sensitive diaphragm for silicon microphone applications. In 2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers (pp. 73-76). [4107451] (2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers). https://doi.org/10.1109/IMPACT.2006.312194