A semi-lumped balun fabricated by low temperature co-fired ceramic

Ching Wen Tang, Chi-Yang Chang*

*Corresponding author for this work

Research output: Contribution to journalConference article

44 Scopus citations

Abstract

A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.

Original languageEnglish
Pages (from-to)2201-2204
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
DOIs
StatePublished - 1 Jan 2002
EventIEEE MTT-S International Microwave Symposium Digest - Seattle, WA, United States
Duration: 2 Jun 20027 Jun 2002

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