A practical methodology for multi-modality electromigration lifetime prediction

M. H. Lin, G. S. Yang, Y. L. Lin, M. T. Lin, C. C. Lin, M. S. Yeh, K. P. Chang, K. C. Su, J. K. Chen, Y. J. Chang, Ta-Hui Wang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

Multiple electromigration failure mechanism was observed in advanced dual damascene Cu interconnects. The complex failure behaviors make precision lifetime prediction more challenging. In the present work, multi-modality electromigration behavior of Cu dual damascene interconnects were studied. Both superposition and weak link models were used for statistical determination of lifetimes of each failure model (statistical method). Results were correlated to the lifetimes of respective failure models physically identified according to resistance time evolution behaviors (Physical method). Good agreement was achieved.

Original languageEnglish
Title of host publication2002 IEEE International Integrated Reliability Workshop Final Report, IRW 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages50-54
Number of pages5
ISBN (Electronic)0780375580
DOIs
StatePublished - 1 Jan 2002
EventIEEE International Integrated Reliability Workshop Final Report, IRW 2002 - Lake Tahoe, United States
Duration: 21 Oct 200224 Oct 2002

Publication series

NameIEEE International Integrated Reliability Workshop Final Report
Volume2002-January

Conference

ConferenceIEEE International Integrated Reliability Workshop Final Report, IRW 2002
CountryUnited States
CityLake Tahoe
Period21/10/0224/10/02

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