A patterned dielectric support process for high performance passive fabrication

C. C. Chen*, Ssu Ying Chen, Yu-Ting Cheng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

This letter presents a micromachining process to effectively reduce substrate loss via a structure of patterned oxide/nitride fins on a silicon substrate with a resistivity of 1 Ω-cm. Experimental results demonstrate that the insertion loss of a coplanar waveguide (CPW) deposited on the structure can be lowered to the value of 4.33 dB/cm at 40 GHz. Meanwhile, an analytical model is developed to predict the characteristics of the CPW.

Original languageEnglish
Pages (from-to)82-84
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume18
Issue number2
DOIs
StatePublished - 1 Feb 2008

Keywords

  • Coplanar waveguide (CPW)
  • Effective dielectric constant
  • Equivalent impedance
  • Oxide/nitride fins
  • Radio frequency integrated circuit (RFIC)
  • Substrate loss

Fingerprint Dive into the research topics of 'A patterned dielectric support process for high performance passive fabrication'. Together they form a unique fingerprint.

Cite this