A novel SPICE compatible current model for OLED circuit simulation

Yiming Li*, Jam Wen Lee, Bo Shian Lee, Chien Sung Lu, Wei Hsin Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Scopus citations

Abstract

In this paper we propose a new equivalent circuit model of organic light emitting device (OLED). The physical-based model is considering the effect of high built-in voltage existing between the organic materials and the effect of non-ideal ohmic occurring at the contact between metal and organic. Compared with the measured IV data of RGB OLED samples and the result of conventional OLED model, the new one successfully shows the physical meaning and simulation accuracy. This model is SPICE-compatible and can be incorporated into circuit simulation without numerical difficulties.

Original languageEnglish
Title of host publication2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings
EditorsM. Laudon, B. Romanowicz
Pages103-106
Number of pages4
StatePublished - 2005
Event2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 - Anaheim, CA, United States
Duration: 8 May 200512 May 2005

Publication series

Name2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings

Conference

Conference2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005
CountryUnited States
CityAnaheim, CA
Period8/05/0512/05/05

Keywords

  • Circuit simulation
  • Compact model
  • Equivalent circuit model
  • High built-in voltage
  • Non-ideal ohmic effect
  • OLED
  • RGB
  • SPICE model

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  • Cite this

    Li, Y., Lee, J. W., Lee, B. S., Lu, C. S., & Chen, W. H. (2005). A novel SPICE compatible current model for OLED circuit simulation. In M. Laudon, & B. Romanowicz (Eds.), 2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings (pp. 103-106). (2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings).