A novel Si-based X'tal oscillator device using 3D integration technologies

Jian Yu Shih, Yen Chi Chen, Chih Hung Chiu, Chung Lun Lo, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A novel Si-based X'tal oscillator device (1.2 mm × 1.0 mm) is demonstrated by using 3D integration technologies. It is distinct from conventional X'tal oscillator device with ceramics and metal lid. The novel Si-based X'tal oscillator device shows no leakage path, and passes the hermetic encapsulation test and reliability investigation. In addition, the novel device shows the excellent electrical characteristics and provides the possibility to replace the conventional fabrication approach for the next generation products.

Original languageEnglish
Title of host publicationProceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014
PublisherIEEE Computer Society
ISBN (Print)9781479922178
DOIs
StatePublished - 1 Jan 2014
Event2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014 - Hsinchu, Taiwan
Duration: 28 Apr 201430 Apr 2014

Publication series

NameProceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014

Conference

Conference2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014
CountryTaiwan
CityHsinchu
Period28/04/1430/04/14

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