A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication

Shih Wei Lee, Geng Ming Chang, Ching Yun Chang, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

A sealing redistribution layer (RDL) approach for the interposer fabrication is developed to simplify the conventional bottom-up process flow. By using this approach, bottom-up plating can achieve the integration of Cu-filler plating and its bottom RDL simultaneously. In this paper, through-glass via in glass interposer or 3-D integration is fabricated using the proposed approach. The electrical measurement and reliability tests indicate that the proposed approach can be an attractive candidate for interposer fabrication with great performance.

Original languageEnglish
Article number7809077
Pages (from-to)132-135
Number of pages4
JournalIEEE Journal of the Electron Devices Society
Volume5
Issue number2
DOIs
StatePublished - 1 Mar 2017

Keywords

  • 3D integration
  • Through-Glass via (TGV)
  • glass interposer
  • redistribution layer

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