A novel integrated structure of thin film GaN LED with ultra-low thermal resistance

Shih Yi Wen, Hung Lieh Hu, Yao Jun Tsai, Chen Peng Hsu, Re Ching Lin, Ray-Hua Horng

Research output: Contribution to journalArticle

11 Scopus citations

Abstract

This study proposes a novel packaging structure for vertical thin-GaN LED applications by integration of LED chip and silicon-based packaging process. The vertical thin film LED is directly mounted on package submount. The shortest thermal path structure from junction to package submount achieves the lowest thermal resistance of 1.65 K/W for LED package. Experimental results indicate that low thermal resistance significant improved forward current up to 4.6A with 1.125 × 1.125 mm2 LED chip size.

Original languageEnglish
JournalOptics Express
Volume22
Issue numberSUPPL. 3
DOIs
StatePublished - 1 Jan 2014

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