A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film

Pao-Yun Tang, Wei Hao Sung, Kei-Hsiung Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

A novel composite bump, Smart bump, structure has been successfully developed for chip-on-glass (COG) package using non-conductive adhesive film (NCF). We have successfully verified the low contact resistance and high reliabilities using Smart bump and COG NCF process for the packages of 17"W, 12.1" and 2.4" TFT-LCD modules. We have realized that COG NCF process with Smart bump is simpler and lower cost in consumable materials than the conventional COG ACF process with Au bump. The COG NCF process also allows fine-pitch-driver package for high-resolution TFT-LCDs, and has a higher process yield in pilot production.
Original languageEnglish
Title of host publication2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III
Number of pages834
StatePublished - 2009

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