A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration

Yu Chen Hu, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking.

Original languageEnglish
Article number7444113
Pages (from-to)185-188
Number of pages4
JournalIEEE Journal of the Electron Devices Society
Volume4
Issue number4
DOIs
StatePublished - 1 Jul 2016

Keywords

  • 3D integration
  • Bonding
  • Fine-pitch application
  • Flexible substrate

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