A novel 3D integration scheme for backside illuminated CMOS image sensor devices

Cheng Ta Ko, Zhi Cheng Hsiao, Hsiang Hung Chang, Dian Rong Lyu, Chao Kai Hsu, Huan Chun Fu, Chun Hsien Chien, Wei Chung Lo, Kuan-Neng Chen

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

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Chemical Compounds

Engineering & Materials Science