A new physical model for life time prediction of Pb-free solder joints in electromigration tests

Tian Tian*, A. M. Gusak, O. Yu Liashenko, Jung Kyu Han, Daechul Choi, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

We have employed high resolution synchrotron radiation x-rays 3D imaging techniques, both tomography and laminography, to study the electromigration (EM) failure mechanism in flip-chip solder joints. In these studies, the ex-situ imaging of the early-stage damage evolution at the interface between UBM and solder balls, revealed that the EM induced failure mode of solder joints could be described by Johnson-Mehl-Avrami (JMA) kinetics model. Thus, the JMA kinetics is proposed to serve as a new physical model for life-time prediction of Pb-free solder joints in EM tests. A corresponding Monte Carlo simulation was developed to investigate this simplified failure model and the dependence of the scale parameter and shape parameter in the statistical Weibull equation on the physical factors of the EM tests was studied.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages741-746
Number of pages6
DOIs
StatePublished - 4 Oct 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 29 May 20121 Jun 2012

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period29/05/121/06/12

Fingerprint Dive into the research topics of 'A new physical model for life time prediction of Pb-free solder joints in electromigration tests'. Together they form a unique fingerprint.

  • Cite this

    Tian, T., Gusak, A. M., Liashenko, O. Y., Han, J. K., Choi, D., & Tu, K-N. (2012). A new physical model for life time prediction of Pb-free solder joints in electromigration tests. In 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 (pp. 741-746). [6248915] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2012.6248915