A low temperature inkjet printing and filling process for low resistive silver TSV fabrication in a SU-8 substrate

Tsung Han Yang, Zi Li Guo, Yu Min Fu, Yu-Ting Cheng*, Yen Fang Song, Pu-Wei Wu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

The paper presents a low temperature (with 60 °C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully filled TSV with the lowest electrical resistivity of ∼450 μΩ•cm in comparison with the prior printing and filling technologies.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages749-752
Number of pages4
ISBN (Electronic)9781509050789
DOIs
StatePublished - 23 Feb 2017
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 22 Jan 201726 Jan 2017

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period22/01/1726/01/17

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