A low-power wireless bondwire inertial sensor system

Shih Chieh Huang, Shao Yung Lu, Fu Yuan Cheng, Tsung Heng Tsai, Yu-Te Liao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 μm CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.

Original languageEnglish
Title of host publication2015 IEEE SENSORS - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479982028
DOIs
StatePublished - 1 Nov 2015
Event14th IEEE SENSORS - Busan, Korea, Republic of
Duration: 1 Nov 20154 Nov 2015

Publication series

Name2015 IEEE SENSORS - Proceedings

Conference

Conference14th IEEE SENSORS
CountryKorea, Republic of
CityBusan
Period1/11/154/11/15

Keywords

  • Accelerometer
  • Bondwire
  • CMOS integration
  • Inertial sensor

Fingerprint Dive into the research topics of 'A low-power wireless bondwire inertial sensor system'. Together they form a unique fingerprint.

Cite this