A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems

Chia Yi Lin*, Wai-Chi Fang, Hung-Ming Chen, Zong Han Hsieh, Chiu Kuo Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

In this paper, a low noise and robust test scheme for 3D stacked integrated circuits based on modified standard IEEE 1149.4 has been proposed. Through the modified standard, this novel test scheme can be more robust to fulfill the microsystem integration requirements. This test scheme also makes the analog pins more observable and testable during and after the integration. The proposed test scheme is validated with preliminary results. This invention provides a useful test method to guide system designers to achieve a low noise and robust test scheme while designing system specifications.

Original languageEnglish
Title of host publicationProceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011
Pages9-13
Number of pages5
DOIs
StatePublished - 23 May 2011
Event2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011 - Bethesda, MD, United States
Duration: 7 Apr 20118 Apr 2011

Publication series

NameProceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011

Conference

Conference2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011
CountryUnited States
CityBethesda, MD
Period7/04/118/04/11

Keywords

  • Low noise
  • Robust
  • System-in-Package
  • Test scheme

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