@inproceedings{63e789842b3b46078c572b5e07798019,
title = "A low-cost DC-to-92 GHz broadband three-path bondwire interconnect",
abstract = "This paper presents a low-cost and broadband bondwire interconnect for chip-to-chip and chip-to-carrier communications. Four transmission lines and three signal bondwires form a three-path interconnect structure which can greatly reduce the bondwire effect. Ground bondwires are also carefully deployed to have good ground connection between chips or chip and carrier. An interconnect from a 0.18-μm CMOS chip to a Glass-Integrated-Passive-Device (GIPD) carrier is designed to verify the idea. Measured results of three samples show that the insertion loss and return loss can be better than 3 dB and 11.2 dB from DC up to 92 GHz.",
keywords = "Bondwire, Broadband, Chip-to-chip and chip-to-carrier communications, Low-cost",
author = "Wu, {Wei Min} and Yu, {Ming Che} and Li, {Chun Hsing} and Chien-Nan Kuo",
year = "2016",
month = jan,
day = "8",
doi = "10.1109/RFIT.2015.7377878",
language = "English",
series = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "34--36",
booktitle = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",
address = "United States",
note = "null ; Conference date: 26-08-2015 Through 28-08-2015",
}