A low-cost DC-to-92 GHz broadband three-path bondwire interconnect

Wei Min Wu, Ming Che Yu, Chun Hsing Li, Chien-Nan Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper presents a low-cost and broadband bondwire interconnect for chip-to-chip and chip-to-carrier communications. Four transmission lines and three signal bondwires form a three-path interconnect structure which can greatly reduce the bondwire effect. Ground bondwires are also carefully deployed to have good ground connection between chips or chip and carrier. An interconnect from a 0.18-μm CMOS chip to a Glass-Integrated-Passive-Device (GIPD) carrier is designed to verify the idea. Measured results of three samples show that the insertion loss and return loss can be better than 3 dB and 11.2 dB from DC up to 92 GHz.

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages34-36
Number of pages3
ISBN (Electronic)9781467377942
DOIs
StatePublished - 8 Jan 2016
EventIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan
Duration: 26 Aug 201528 Aug 2015

Publication series

Name2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

Conference

ConferenceIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
CountryJapan
CitySendai
Period26/08/1528/08/15

Keywords

  • Bondwire
  • Broadband
  • Chip-to-chip and chip-to-carrier communications
  • Low-cost

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