A low-cost broadband bondwire interconnect for heterogeneous system integration

Chun Hsing Li, Chun Lin Ko, Chien-Nan Kuo, Ming Ching Kuo, Da Chiang Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

A low-cost broadband interconnect, composed of bondwires and transmission lines, is proposed for heterogeneous system integration. By designing the length and the characteristic impedance of the transmission lines, the bondwire effect can be reduced to provide an interconnect with good return loss and low insertion loss. In this work, the chip and the carrier are realized in 90-nm CMOS and GIPD process, respectively. Measured results show that the return loss and the insertion loss are better than 10 dB and 1.1 dB, respectively, from DC to 45.2 GHz.

Original languageEnglish
Title of host publication2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
DOIs
StatePublished - 1 Dec 2013
Event2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013 - Seattle, WA, United States
Duration: 2 Jun 20137 Jun 2013

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Conference

Conference2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
CountryUnited States
CitySeattle, WA
Period2/06/137/06/13

Keywords

  • Bondwire
  • Broadband
  • Heterogeneous integration
  • Interconnect
  • Transmission lines

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  • Cite this

    Li, C. H., Ko, C. L., Kuo, C-N., Kuo, M. C., & Chang, D. C. (2013). A low-cost broadband bondwire interconnect for heterogeneous system integration. In 2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013 [6697395] (IEEE MTT-S International Microwave Symposium Digest). https://doi.org/10.1109/MWSYM.2013.6697395