A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes

Wei Chih Lin*, Chao Chiun Liang, Ching Hsiang Tsai, Chien-Wen Hsieh, Lung Jieh Yang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper mainly describes a liquid-based gravity-driven etching-stop technique used for cantilever thickness control of Atomic Force Microscope (AFM) probes on the wafer level. The technique makes use of the method of opposite etching trenches or the depth rulers. A pair of opposite trenches surrounds several AFM probes on both sides of the wafer to form probe chips. The trench depth on the cantilever front-side is equal to the designed thickness of cantilevers. In the final step of the fabrication process for AFM probes, the wafer is etched by the KOH etchant to form the probe handles. The probe chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated probes fall into the Diiodomethane (CH 2I2) solution beneath the KOH etchant and the wet-etching stops automatically. The cantilever thickness of the AFM probes can then be wafer-level controlled by the proposed etching-stop technique.

Original languageEnglish
Title of host publicationProceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
Pages500-503
Number of pages4
DOIs
StatePublished - 25 Oct 2005
Event18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States
Duration: 30 Jan 20053 Feb 2005

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
CountryUnited States
CityMiami Beach, FL
Period30/01/053/02/05

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