A Hybrid Wafer-Dicing Process for GaAs MMIC Production

Edward Yi Chang, Richard Dean, James Proctor, Robert Elmer, Krishna Pande

Research output: Contribution to journalArticle

4 Scopus citations


A dicing process for GaAs MMIC wafers, using spin-on wax for wafer mounting and a hybrid process of wet chemical etching/ mechanical sawing for chip dicing is described. This process minimizes ragged chip edges and reduces generation of microcracks in addition to the elimination of the plated gold burrs on the backside of the diced MMIC chips. The GaAs chip dicing technique described in this paper is easily amenable to production as it exhibits both a very high chip yield (>90%) and nearly flawless edges.

Original languageEnglish
Pages (from-to)66-68
Number of pages3
JournalIEEE Transactions on Semiconductor Manufacturing
Issue number1
StatePublished - 1 Jan 1991

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