A highly integrated biomedical multiprocessor SoC design for a wireless bedside monitoring system

Kuen Chih Lin, Jui Chieh Liao, Wai-Chi  Fang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

This paper presents a highly integrated multiprocessor system-on-chip (SoC) design, enabling real-time processing of multi-biomedical signals in a wireless bedside monitoring system. This system includes a real-time online recursive independent component analysis (ORICA) processor to automatically remove brain electroencephalogram (EEG) artifacts signals, a heart rate variability (HRV) analysis processor for monitoring electrocardiogram (ECG) signals, and a basic biomedical signal processor for monitoring common physiological data such as oxygen saturation, blood pressure, or body temperature. The multiprocessor chip is fabricated using TSMC 90 nm CMOS technology, and occupies a core area of 1,600 × 1,600 um2. Simulated power consumption is 15.89 mW under the conditions of 1.0V core supply voltage and 64 MHz clock operation frequency.

Original languageEnglish
Title of host publication2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1392-1395
Number of pages4
ISBN (Print)9781479934324
DOIs
StatePublished - 1 Jan 2014
Event2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014 - Melbourne, VIC, Australia
Duration: 1 Jun 20145 Jun 2014

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Conference

Conference2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
CountryAustralia
CityMelbourne, VIC
Period1/06/145/06/14

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    Lin, K. C., Liao, J. C., & Fang, W-C. (2014). A highly integrated biomedical multiprocessor SoC design for a wireless bedside monitoring system. In 2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014 (pp. 1392-1395). [6865404] (Proceedings - IEEE International Symposium on Circuits and Systems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2014.6865404