A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu*, L. Pu, Y. Yang, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. N. Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

Original languageEnglish
Article number100101
JournalMaterials Today Advances
Volume7
DOIs
StatePublished - Sep 2020

Keywords

  • Advanced electronic packaging technology
  • Diffusion kinetics
  • High-entropy alloy
  • Liquid-solid reactions
  • Pb-free solder

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