@inproceedings{6f42b9bc8bb449f9bb1fd24337fdce37,
title = "A GaN 3×3 matrix converter chipset with Drive-by-Microwave technologies",
abstract = "A matrix converter [1] that directly transduces power and frequency by bidirectional switches has been expected to be an ultimate AC-to-AC converter because it eliminates limited-lifetime capacitors and achieves high efficiency power conversion even without PFC (Power Factor Control) circuits. However, it has not been practically realized due to the following issues resulting from the abundant components it includes. There has been no existing monolithic bidirectional switch that offers a high blocking voltage with current-handling capability and no compact isolated gate driver that provides a gate signal against a positive/negative voltage reference at every moment. Consequently, the matrix converter with discrete components makes the system large and complicated because of numerous power switches and isolated drivers. Relevant to this discussion, GaN devices [2] are very attractive in power applications since the GaN bidirectional power switches with a high blocking voltage can be monolithically implemented by using its lateral device structure [3]. Additionally, a GaN Drive-by-Microwave (DBM) isolated gate driver [4] is the best candidate for a matrix converter, because it is very compact being both photo-coupler and transformer free and co-integratable with GaN power devices. These GaN integration technologies are very valuable in terms of a high-speed switching with less inductance among lines as well as offering a small system size.",
author = "Shuichi Nagai and Yasuhiro Yamada and Noboru Negoro and Hiroyuki Handa and Yuji Kudoh and Hiroaki Ueno and Masahiro Ishida and Nobuyuki Otuska and Daisuke Ueda",
year = "2014",
month = jan,
day = "1",
doi = "10.1109/ISSCC.2014.6757527",
language = "English",
isbn = "9781479909186",
series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "494--495",
booktitle = "2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers",
address = "United States",
note = "null ; Conference date: 09-02-2014 Through 13-02-2014",
}