A dynamic thermal management circuit for system-on-chip designs

Her-Ming Chiueh*, Jeffrey Draper, John Choma

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

A novel fully integrated dynamic thermal management circuit for system-on-chip design is proposed and will be implemented in a VLSI device. Instead of worst-case thermal management used in conventional systems, this design yields continual monitoring of thermal activity and reacts to specified conditions. With the above system, we are able to incorporate on-chip powerlspeed modulation and an integrated multi-stage fan controller, which allows us to achieve nominal power dissipation and ensure operation within specification. Both architecture and circuitry are optimized for modem system-on-chip designs. This design yields intricate control and optimal management with little system overhead and minimum hardware requirements, as well as provides the flexibility to support different management algorithms. This circuit will be fabricated in a TSMC 0.25μm process through MOSIS.

Original languageEnglish
Title of host publicationICECS 2001 - 8th IEEE International Conference on Electronics, Circuits and Systems
Pages577-580
Number of pages4
DOIs
StatePublished - 1 Dec 2001
Event8th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2001 - , Malta
Duration: 2 Sep 20015 Sep 2001

Publication series

NameProceedings of the IEEE International Conference on Electronics, Circuits, and Systems
Volume2

Conference

Conference8th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2001
CountryMalta
Period2/09/015/09/01

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