A compressed-sensing sensor-on-chip incorporating statistics collection to improve reconstruction performance

Vahid Behravan, Shuo Li, Neil E. Glover, Chia-Hung Chen, Mohammed Shoaib, Gabor C. Temes, Patrick Y. Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

Reconstructing signals accurately is a critical aspect of compressed sensing. We propose a compressed-sensing sensor-on-chip that compresses and also extracts key statistics of the input signal at sampling time. These statistics can be used at the receiver to significantly improve the accuracy of reconstruction. When compared against a conventional compressed-sensing system, our experimental measured results demonstrate an improvement of as much as 9-18 dB in the signal-to-error (SER) of the reconstructed signal, depending on input data type and compression factor.

Original languageEnglish
Title of host publication2015 IEEE Custom Integrated Circuits Conference, CICC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479986828
DOIs
StatePublished - 25 Nov 2015
EventIEEE Custom Integrated Circuits Conference, CICC 2015 - San Jose, United States
Duration: 28 Sep 201530 Sep 2015

Publication series

NameProceedings of the Custom Integrated Circuits Conference
Volume2015-November
ISSN (Print)0886-5930

Conference

ConferenceIEEE Custom Integrated Circuits Conference, CICC 2015
CountryUnited States
CitySan Jose
Period28/09/1530/09/15

Keywords

  • compressed sensing
  • reconstruction error
  • sensor-on-chip
  • statistics collection

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    Behravan, V., Li, S., Glover, N. E., Chen, C-H., Shoaib, M., Temes, G. C., & Chiang, P. Y. (2015). A compressed-sensing sensor-on-chip incorporating statistics collection to improve reconstruction performance. In 2015 IEEE Custom Integrated Circuits Conference, CICC 2015 [7338429] (Proceedings of the Custom Integrated Circuits Conference; Vol. 2015-November). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CICC.2015.7338429