A compact plastic package with high RF isolation by subsidiary inner ground leads

Hidetoshi Ishida*, Kazuo Miyatsuji, Tsuyoshi Tanaka, Daisuke Ueda, Chihiro Hamaguchi

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

A novel method to obtain a compact plastic package with higher isolation by providing subsidiary inner ground leads between outer leads is proposed and demonstrated. The effect of the subsidiary ground leads is investigated by using a 3-dimensional electromagnetic field simulation and measuring the fabricated packages. Newly designed package with subsidiary ground leads achieves higher isolation by more than 10 dB at 3 GHz as compared to a conventional package. This package is applied to GaAs SPDT switch IC's. Isolation of the switch IC's is improved by 5 dB at 3 GHz by the subsidiary inner ground leads. The isolation characteristics are discussed based on the equivalent circuit extracted from the simulation results.

Original languageEnglish
Pages (from-to)2044-2048
Number of pages5
JournalIEICE Transactions on Electronics
VolumeE82-C
Issue number11
StatePublished - 1 Jan 1999

Keywords

  • electromagnetic simulation
  • high
  • isolation
  • package
  • subsidiary ground

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    Ishida, H., Miyatsuji, K., Tanaka, T., Ueda, D., & Hamaguchi, C. (1999). A compact plastic package with high RF isolation by subsidiary inner ground leads. IEICE Transactions on Electronics, E82-C(11), 2044-2048.