A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate

Yu Min Fu, Yen R. Liang, Yu-Ting Cheng, Pu-Wei Wu

Research output: Contribution to journalArticle

12 Scopus citations

Abstract

In this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 μm and resistivities of ∼9.8 μΩ · cm on a flexible polyimide substrate via thermal sintering at 300 °C for 30 min. In addition, a printed interdigitated capacitor with an electrode line width and spacing of 10 μm and a printed spiral square inductor with a 10-μm line width and 5-μm spacing in an area of 1 mm2 have been successfully demonstrated with an area capacitance and inductance of 0.43 pF/mm2 at 10 KHz and 1.054 μH/mm2 up to 100 KHz, respectively, which are the orders of magnitude performance improvement in comparison with the contemporary inkjet-printed capacitors and inductors. Owing to the significant reduction of energy demand in processing tools and waste generation in processing materials, the results have revealed that the CPLoP process can facilitate the advancement of printing manufacture technology for microelectronics applications.

Original languageEnglish
Article number7047690
Pages (from-to)1248-1254
Number of pages7
JournalIEEE Transactions on Electron Devices
Volume62
Issue number4
DOIs
StatePublished - 1 Apr 2015

Keywords

  • Flexible electronics
  • flexible inkjet printing
  • inductor
  • printed microsystems

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